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ARS-111GL-DNHR-LCC
$104,155.00 Configured Summary
ARS-111GL-DNHR-LCC
Supermicro 1U 2Nodes 4Bays NVIDIA Grace CPU Rackmount GPU Server
 
This system currently supports two E1.S drives direct to the processor and the onboard GPU only. 
Two nodes in a 1U form factor. Each node supports the following:
  • High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node)
  • NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
  • High Performance Computing, AI/Deep Learning Training and Inference, Large Language Model (LLM) and Generative AI
 
To maintain quality and integrity, this product is sold only as a completely-assembled system
 
System (SKU) ARS-111GL-DNHR-LCC
Processor and GPU Spec 72 Core Grace Processor with H100 96GB HBM3 on a Superchip X2
Memory 480GB LPDDR5 with 96GB HBM3 memory for GPU (included on Superchip) X2
Storage 14T TB raw capacity (2x 7.0 TB NVMe SSDs) X2
Boot Drives 2x 960 GB M.2 SSD X2
Networking 1x 400G HDR IB CX7 NICs (GPU Fabric) X2
 
   ARS-111GL-NHR   
SMC Product ID SMC Mat Descr Qty
ARS-111GL-DNHR-LCC ARS-111GL-DNHR-LCC, MBD-G1SMH-G 1U ARM CG1 GEN5 PCIE 1
HDS-IEN0-SSDPFUKX076T1 Intel D7-P5520 EDSFF E1.S PCIe 4x4TLC9.5mm 7.68TB <2DWPD 4
HDS-MMN-MTFDKBG960TFR1B Micron 7450 PRO 960GB NVMe PCIe 4.0 M.2 22x110mm 3D TLC, 4
AOC-CX766003N-SQ0 900-9X766-003N-SQ0 1-p NDR 400G IB/ETH OSFP Crypto Disabled 2
GPU-NVGH480-12V NVIDIA GH200, CG1, 480GB LPDDR5X CPU, 96GB HBM3 GPU, 12V 2
MC0037 ASSEMBLY FEE 1
EWCSC 0% 3 YRS LABOR, 3 YRS PARTS, 1 YR CRS UNDER LIMITED WRNTY 1
Note: Image above may show a varied configuration or optional part. Please refer to parts list for standard parts included.
SKU ARS-111GL-DNHR-LCC
Processor
(per Node)
CPU:
NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip
Note:
Supports up to 2000W TDP CPUs (Liquid Cooled)​
 
GPU
Max GPU Count:

Up to 1 onboard GPU
Supported GPU:
NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)
View GPU Options
CPU-GPU Interconnect:
NVLink®-C2C
GPU-GPU Interconnect:
PCIe
Memory
Slot Count: Onboard Memory
Max Memory: Up to 480GB ECC LPDDR5X
Additional GPU Memory: Up to 96GB ECC HBM3
Chassis
1U Rackmount Chassis
Dimensions
Height:
1.75" (44 mm)
Width:
17.33" (440 mm)
Depth:
37" (940 mm)
Bios
BIOS Type:
AMI 64MB SPI Flash EEPROM
HDD Drive Bays
Default: 
Total 4 bays
4 front hot-swap E1.S NVMe drive bays

M.2:
2 M.2 NVMe slots (M-key)
Expansion Slots
Default
2 PCIe 5.0 x16 FHFL slots
Power Supply
2x 2700W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL):
73.5 x 40 x 185 mm

Input:
2700W: 200-240Vac / 50-60Hz
2700W: 240-240Vdc / 50-60Hz (for CQC only)

+12V:
Max: 225A / Min: 0A (200Vac-240Vac)
Max: 225A / Min: 0A (240Vdc-240Vdc)

12V SB:
Max: 4A / Min: 0A

Output Type:
Backplanes (gold finger)
Input Output
(per Node)
LAN:

1 RJ45 1 GbE Dedicated BMC LAN port
USB:
2 ports(rear)
Video:
1 mini-DP port
Cooling
Fans:
7 Removable heavy-duty 4cm Fan(s)
Liquid Cooling:
Direct to Chip (D2C) Cold Plate (optional)
Operating Environment
Environmental Spec.:
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Details
Management
Power configurations:

Power-on mode for AC power recovery
ACPI Power Management

PC Health Monitoring
CPU:

Monitors for CPU Cores, Chipset Voltages, Memory
FAN:
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature:
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
ARS-111GL-DNHR-LCC
Note: Image above may show a varied configuration or optional part. Please refer to parts list for standard parts included.
3130
1
104155.0000

 

 

 

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